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Wafer Technology Ltd
34 Maryland Road
Tongwell
Milton Keynes
Bucks
MK15 8HJ
United Kingdom
Telephone:
+44 (0)1908 210444
Facsimile:
+44 (0)1908 210443
Email: sales@wafertech.co.uk
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Characterisation
Wafer Technology employs a comprehensive
set of materials characterisation tools to ensure full conformity
of product supplied. All assessment is managed according
to ISO9001:2000 certified quality control systems.
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Structure
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Surface and Flat
Orientation |
X-Ray Diffraction
(Bede Triple Axis Diffractometer) |
Defect Density |
Etching and microscopy |
Bulk
Properties |
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Carrier
concentration |
Keithley Automatic
Hall Test System |
Mobility |
As above |
Resistivity |
As above |
Purity |
GDMS analysis |
Dimensional
Control |
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Flat lengths |
Mitutoyo Optical
Comparitor |
Diameter |
As Above |
Edge Profile |
As Above |
Thickness |
Hoverprobe |
Flatness
(TTV, TIR, Bow, Warp) |
Tropel Autoselect |
Polish
Quality |
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Texture |
Nomarski microscope |
Sub-surface damage |
ETOCAP |
Haze and Particulates |
Tencor Surfscan
6220
Collimated Light Inspection |
Surface composition |
SIMS |
'Epi-ready' performance |
MOCVD and MBE |
As a member of IQE plc, Wafer Technology’s
characterisation portfolio also extends to the regular use
of an extensive Group metrology service which is comprised
of many state-of-the-art wafer assessment tools. These include
advanced surface analysis by atomic force microscopy (Veeco
Digital Instruments DI3100) and 3D surface profilometry (Taylor
Hobson Talysurf CCI 3000). Electrical assessments are made
using contactless sheet resistance (Lehighton LEI 1500RS)
and layer thickness determinations by infra-red microscopy
(Film Expert MKS 2140). Metrology is a critical aspect of
product conformity and together with our own in-house range
of assessment tools enables us to deliver the highest quality
of product.
Please contact us if you would like
to discuss a bespoke range of further wafer characterisation
options. |
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